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US$6.77

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CPU Module Motherboard Reballing Kit Stencils Tin Planting Network Steel Net Repair Tool For iPhone 5S/6/6S/7/7P/8/8P A7 A8 A9 A10 A11

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                  Features:

                  3D laser square hole BGA reballing stencil template.
                  High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
                  New patented iphone X Middle Layer Motherboard  for iPhone X Middle layer motherboard.
                  Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way.
                   
                  Specification:

                  Type: A7 CPU / A8 CPU / A9 CPU / A10 CPU / A11 CPU

                   
                  Package included:

                  1 x BGA Reballing Tool

                   
                  Details pictures:

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